cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 1/7 MTP452L3 cystek product specification p-channel enhancement mode power mosfet MTP452L3 bv dss -30v r dson(max) 55m i d -6a features ? simple drive requirement ? low on-resistance ? fast switching characteristic ? pb-free lead plating package symbol outline absolute maximum ratings (ta=25 c) MTP452L3 sot-223 d s g gate d d drain s source g parameter symbol limits unit drain-source voltage v ds -30 v gate-source voltage v gs 20 v i d -6.0 *1 a continuous drain current @ t a =25 c continuous drain current @ t a =70 c i d -4.8 *1 a pulsed drain current i dm -20 *1 a 2.7 w total power dissipation (t a =25 ) pd 0.02 w/ c linear derating factor operating junction and storage temperature tj, tstg -55~+150 c thermal resistance, junction-to-ambient, max r th,j-a 45 *2 c/w note : *1 . pulse width limited by maximum junction temperature *2 . surface mounted on 1 in 2 copper pad of fr-4 board; 120 c/w when mounted on minimum copper pad
cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 2/7 MTP452L3 cystek product specification characteristics (tj=25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss -30 - - v v gs =0, i d =-250 a bv dss / tj - -0.02 - v/ c reference to 25c, i d =-1ma v gs(th) -1.0 - -3.0 v v ds = v gs , i d =-250 a g fs - 10 - s v ds =-10v, i d =-5.3a i gss - - d 100 na v gs = d 20 i dss - - -1 a v ds =-30v, v gs =0 i dss - - -25 a v ds =-24v, v gs =0, tj=70 c *r ds(on) - 45 55 m v gs =-10v, i d =-5.3a *r ds(on) - 75 100 m v gs =-4.5v, i d =-4.2a dynamic *qg - 9.2 16 *qgs - 2.8 - *qgd - 5.2 - nc i d =-5.3a, v ds =-24v, v gs =-4.5v *t d(on) - 11 - *tr - 8 - *t d(off) - 25 - *t f - 17 - ns v ds =-15v, i d =-1a,v gs =-10v, r g =6 , r d =15 ciss - 507 912 coss - 222 - crss - 158 - pf v gs =0v, v ds =-15v, f=1mhz source-drain diode *v sd - - -1.2 v i s =-2.3a, v gs =0v *trr - 29 - ns *qrr - 20 - nc i s =-5.3a, v gs =0, di/dt=100a/ s *pulse test : pulse width 300 s, duty cycle 2% ordering information device package shipping marking MTP452L3 sot-223 (pb-free lead plating package) 2500 pcs / tape & reel 452
cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 3/7 MTP452L3 cystek product specification typical characteristics
cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 4/7 MTP452L3 cystek product specification typical characteristics(cont.)
cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 5/7 MTP452L3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 6/7 MTP452L3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds ? time(ts min to ts max ) time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c400l3 issued date : 2009.06.22 revised date : page no. : 7/7 MTP452L3 cystek product specification sot-223 dimension *: typical inches millimeters 321 f b a c d e g h a1 a2 i style: pin 1.gate 2.drain 3.source marking: 3-lead sot-223 plastic surface mounted package cystek package code: l3 date code device name 452 inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1142 0.1220 2.90 3.10 g 0.0551 0.0709 1.40 1.80 b 0.2638 0.2874 6.70 7.30 h 0.0098 0.0138 0.25 0.35 c 0.1299 0.1457 3.30 3.70 i 0.0008 0.0039 0.02 0.10 d 0.0236 0.0315 0.60 0.80 a1 *13 o - *13 o - e *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o f 0.2480 0.2638 6.30 6.70 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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